However, if time is of the essence, the analyst oftentimes delids the package and runs a voltage contrast map in the SEM.1973, International Microelectronics conference, Proceedings of the technical program, page 155:
It was time to delid a Fujitsu chip.1984, William S. Burroughs, Esquire: The Magazine for Men - Volume 102, page 78:
1 more example
Our chemical delidding experiments were carried out with flip chip packages having aluminum and AlSiC lids and organic substrates, with die sizes from 6.6mm to 17mm and package body sizes from 23mm to 45mm.2004, Microelectronics Failure Analysis: Desk Reference, →ISBN, page 2004:
2
To remove the lid from a can.
Vise-like clamping action of lid remover jaws assures reliable lid removal every time. Model 825 Can Opening System washes cans, opens cans, delids cans and dumps product automatically at a rate of 40 cans per minute with one operator.1983, Processed Prepared Food - Volume 152, page 87:
The solid food system automatically opens cans, delids cans, and dumps the product aided by various dumping assists; vibrator, bottom punch, water jets, and needle punch with airblow.1984, Food Production/management - Volume 107, page 33:
1 more example
A can opening system automatically washes, opens, delids and dumps contents of up to 30 #10 cans per minute.1990, Hotels: The Magazine of the Worldwide Hotel Industry, page 69:
delid
noun
Etymology From de- + lid.
1
The process of delidding.
Excessive leakage currents were measured for four chips (2 NPN, 1 PNP, and 1 diode) after the delid operation.1972, International Society for Hybrid Microelectronics, 1972 International Microelectronic Symposium:
After chip attach, wire bonding, and preliminary testing, this configuration is then hermetically sealed by routine seam welding of a Kovar lid onto the seal ring. The seal ring and lid were designed to permit two delid and rework cycles if necessary.1994, Proceedings of the International Conference on Multichip Modules:
1 more example
For the chemical delid process, note that the devices and the solvents should come to temperature simultaneously, as adding a room-temperature package to a hot solvent can cause die cracking in large packages (effectively acts as a thermal shock).2004, Microelectronics Failure Analysis: Desk Reference, →ISBN: